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COMPANY RESEARCH / 000660.KS

SK hynix

Low-power DRAM & flash memory

Published by FyncaResearch checked How we research

HUMANOID ROBOT

Where it fits in the robot

SK hynix develops LPDDR and NAND products supporting efficient on-device AI and embedded compute workloads.

What the evidence establishes

Adjacent technology

LPDDR products support low-power on-device AI. Their use in a particular humanoid is inferred, not established by the cited mobile-memory release.

A relevant component capability. Its use in humanoids is an inference, not a disclosed customer relationship.

Component roleLow-power DRAM & flash memory
EvidenceLPDDR products support low-power on-device AI. Their use in a particular humanoid is inferred, not established by the cited mobile-memory release.
Primary sourceSK hynix — supporting disclosure
Company or official disclosure; vendor claims are attributed to their source.
Checked. This is the research review date, not the source publication or quote time.

Keep in perspective

Robotic relevance is inferred from memory requirements. The source does not establish humanoid customer contracts.

Specialist business exposure. This describes the breadth or role of the business; it is not an investment rating. A robotics product or development announcement does not by itself establish material humanoid revenue, market share, or future returns.

Connections to the assembly

These links explain the technology relationship. The model is illustrative and does not represent an actual manufacturer’s bill of materials.

Working memory & storage

Memory holds the working data used by perception and control; nonvolatile storage retains software and models. Capacity, bandwidth, and power consumption affect performance.

Scope of the company links: Memory manufacturers only. Micron explicitly discusses humanoids; Samsung and SK hynix are adjacent low-power memory exposure.

AI SERVER RACK

Where it fits in an AI server rack

Ranked first in HBM with a 56.4% revenue share in Q1 2026 (its SEC prospectus). Began mass shipments of HBM4 in Q2 2026 with a ramp in H2; SOCAMM2 sales grew significantly, and it expanded sales of HBM, DRAM for AI servers and eSSD (Q2 2026 results). NVIDIA’s FY2026 10-K names SK Hynix as a memory supplier, and a multiyear partnership (June 7, 2026) covers codeveloped memory for Vera Rubin systems and Vera CPUs.

What the evidence establishes

AI-rack evidence

Disclosed: SK hynix’s Q2 2026 results report HBM4 mass shipments and SOCAMM2 growth; NVIDIA’s FY2026 10-K separately names SK Hynix as a memory supplier.

An explicit AI-server or AI-rack product, design-in, supply role, program, reference design or partnership, such as a part named for rack-scale AI systems or a product sold for AI data centers. For a rack builder, it means the company’s own AI servers or racks. This does not establish revenue, market share, volumes or future sourcing.

Component roleHBM3E and HBM4 stacks, SOCAMM2 and eSSD for AI servers
EvidenceDisclosed: SK hynix’s Q2 2026 results report HBM4 mass shipments and SOCAMM2 growth; NVIDIA’s FY2026 10-K separately names SK Hynix as a memory supplier.
How we knowDisclosed The company’s own filing, release, annual report, product page or investor record describes the AI-server or AI-rack role. Where customers are unnamed, the listing says so.
Primary sourceSK hynix — supporting disclosure
Company or official disclosure; vendor claims are attributed to their source.
Checked. This is the research review date, not the source publication or quote time.

Keep in perspective

SK hynix does not name its HBM customers; its two largest customers were 14.8% and 12.4% of Q1 2026 revenue. The NVIDIA partnership release does not name HBM products, and the 56.4% share is the figure cited in its prospectus.

Specialist business exposure. This describes the breadth or role of the business; it is not an investment rating. An AI-server product, design-in or partnership does not by itself establish material AI-rack revenue, market share, or future returns.

Connections to the assembly

These links explain the technology relationship. The model is illustrative and does not represent an actual manufacturer’s bill of materials.

HBM stacks

Towers of 8 to 12 DRAM dies joined by through-silicon vias and placed beside the logic dies. Eight stacks give one GPU hundreds of gigabytes and several terabytes per second of memory bandwidth.

Scope of the company links: Three companies make HBM, and NVIDIA’s FY2026 10-K names all three (SK Hynix, Micron, Samsung) as memory suppliers. Micron is mapped first because its release names GB300 NVL72 and GB200 NVL72 (and the AMD MI350 Series) for its HBM3E. SK hynix reports HBM4 mass shipments from Q2 2026 and a 56.4% HBM revenue share in Q1 2026 (its prospectus), without naming customers. Samsung says its HBM4 is designed for NVIDIA Vera Rubin and in mass production; its HBM3E qualification for NVIDIA (Sept 2025) is reported only. No source gives a supplier’s share of a specific GPU.

CPU memory

Low-power LPDDR5X packages or modules beside an Arm CPU, or DDR5 memory modules with interface chips in x86 trays. The GPUs can reach this memory through the CPU.

Scope of the company links: Grace-class CPUs use LPDDR5X (up to 17 TB per GB200 NVL72, NVIDIA). Micron says its SOCAMM LPDDR5X module was developed with NVIDIA for GB300 and was in volume production (Mar 18, 2025); SK hynix reports significantly growing SOCAMM2 sales for AI servers (Q2 2026), and Samsung markets SOCAMM2 with no named platform. x86 trays use DDR5 RDIMMs or MRDIMMs whose interface chips come from Montage (RCD, MRCD/MDB) and Rambus (RCD, PMIC, SPD hub; a SOCAMM2 chipset from Apr 22, 2026); Renesas is sampling a third-generation MRDIMM chipset, with production expected in 2H 2027.

E1.S NVMe SSDs

Flash drives in the slim EDSFF E1.S form factor: NAND flash, a controller and DRAM that hold the operating system, checkpoints and cached data. Reference trays carry four; some vendors fit up to eight in internal bays.

Scope of the company links: E1.S NVMe drives sit in each compute tray (NVIDIA lists four per GB200 tray). The rack-specific qualifications found are Sandisk’s DC SN861 E1.S (certified for GB200 NVL72 as Western Digital, Oct 14, 2024) and Micron’s 9550 and 7450 (on NVIDIA’s GB200 NVL72 recommended vendor list, per Micron). Kioxia (NX1 E1.S for GPU servers) and Samsung (PM1763 for AI infrastructure) position drives for AI servers, SK hynix reports expanding eSSD sales for AI servers, and its subsidiary Solidigm, which is not separately listed, shows a cold-plate-cooled SSD. Silicon Motion, Phison and Marvell sell SSD controllers with no named rack program. A vendor list shows eligibility, not volumes.

Related research

Companies with overlapping sector exposure. Their products and evidence may differ; this is not a list of equivalent investments.

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