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COMPANY RESEARCH / 3711.TW

ASE Technology Holding

2.5D packaging and test (ASE and SPIL)

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Where it fits in an AI server rack

NVIDIA named SPIL, ASE’s wholly owned subsidiary, with Amkor as its packaging and testing partners in Arizona (Apr 14, 2025). ASE’s 2025 Form 20-F lists 2.5D, CoWoS, CoPoS, CoWoP, CPO and 3D IC among its packaging solutions, describes TSV-based 2.5D silicon-interposer packages for high-end GPUs and AI accelerators, and says demand is increasingly driven by customers developing AI processors and accelerators.

What the evidence establishes

AI-rack evidence

Partner-disclosed: NVIDIA names SPIL for packaging and testing in Arizona, and ASE’s 2025 Form 20-F describes its 2.5D silicon-interposer packages for GPUs and AI accelerators.

An explicit AI-server or AI-rack product, design-in, supply role, program, reference design or partnership, such as a part named for rack-scale AI systems or a product sold for AI data centers. For a rack builder, it means the company’s own AI servers or racks. This does not establish revenue, market share, volumes or future sourcing.

Component role2.5D packaging and test (ASE and SPIL)
EvidencePartner-disclosed: NVIDIA names SPIL for packaging and testing in Arizona, and ASE’s 2025 Form 20-F describes its 2.5D silicon-interposer packages for GPUs and AI accelerators.
How we knowPartner-disclosed A named partner, customer or platform owner’s document names the company. The scope is that document’s product or program, not a general supply relationship.
Primary sourceASE Technology Holding — supporting disclosure
Company or official disclosure; vendor claims are attributed to their source.
Checked. This is the research review date, not the source publication or quote time.

Keep in perspective

ASE does not name its AI customers or say which packaging steps it performs for NVIDIA; the Arizona work was a plan in April 2025 and its status is not confirmed. AI packaging is one part of a broad packaging, test and EMS group.

Diversified business exposure. This describes the breadth or role of the business; it is not an investment rating. An AI-server product, design-in or partnership does not by itself establish material AI-rack revenue, market share, or future returns.

Connections to the assembly

These links explain the technology relationship. The model is illustrative and does not represent an actual manufacturer’s bill of materials.

Interposer & 2.5D packaging

A silicon interposer, or silicon bridges in an organic layer, carries thousands of fine wires between the logic dies and the HBM. Building it and assembling the dies onto it is the advanced-packaging step.

Scope of the company links: TSMC’s CoWoS is the packaging NVIDIA names in its 10-K; TSMC produces 5.5-reticle CoWoS and plans 14-reticle packages with 20 HBM stacks for 2028. NVIDIA named Amkor and ASE’s subsidiary SPIL as its packaging and testing partners in Arizona (Apr 2025), and both describe 2.5D silicon-interposer packages for GPUs and HBM in their annual filings. Which steps each performs for a given GPU (chip-on-wafer or on-substrate) is not disclosed, and that Blackwell uses the CoWoS-L variant is reported, not confirmed in our sources. Intel’s EMIB-class packaging has no documented AI-rack program here and is not mapped.

Related research

Companies with overlapping sector exposure. Their products and evidence may differ; this is not a list of equivalent investments.

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