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COMPANY RESEARCH / 8046.TW

Nan Ya Printed Circuit Board

ABF substrates developed for AI and HPC packages

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Where it fits in an AI server rack

Publishes an ABF substrate roadmap (current capability up to 11+N+11 layers and 7.8–140 mm body size, over 150 mm from 2027) and says it is developing high-layer-count (>22L), large-form-factor (>100 mm square) and embedded substrates for customers’ 5G, AI and HPC applications. ASE’s 2025 Form 20-F names it among a limited number of IC substrate suppliers.

What the evidence establishes

Data-center products

Positioning: Nan Ya PCB’s IC substrate development page targets high-layer, large substrates for AI and HPC, with no named customer.

A documented data-center or server product. Adoption in AI racks is not established by the cited source.

Component roleABF substrates developed for AI and HPC packages
EvidencePositioning: Nan Ya PCB’s IC substrate development page targets high-layer, large substrates for AI and HPC, with no named customer.
How we knowPositioning A dedicated AI-server or AI-data-center product or reference design, with no named customer. Marketed for AI racks; not a disclosed design win.
Primary sourceNan Ya Printed Circuit Board — supporting disclosure
Company or official disclosure; vendor claims are attributed to their source.
Checked. This is the research review date, not the source publication or quote time.

Keep in perspective

No named AI customer or AI-server program in the sources captured; AI and HPC are stated as development targets, not shipments.

Diversified business exposure. This describes the breadth or role of the business; it is not an investment rating. An AI-server product, design-in or partnership does not by itself establish material AI-rack revenue, market share, or future returns.

Connections to the assembly

These links explain the technology relationship. The model is illustrative and does not represent an actual manufacturer’s bill of materials.

ABF package substrate

A large multilayer organic substrate made with build-up film. It fans the interposer’s dense connections out to the pitch of the board and carries power to the dies.

Scope of the company links: ABF (FCBGA) package substrates. Ibiden (strong GPU demand, substrates for AI servers and switching ICs) and Samsung Electro-Mechanics (FCBGAs for AI accelerators and server CPUs) disclose AI-accelerator substrate supply without naming customers. Unimicron markets FCBGA for AI servers and switches, and Nan Ya PCB is developing large, high-layer substrates for AI and HPC (positioning). Kinsus is named by ASE as an IC substrate supplier, with no AI program documented. Ajinomoto supplies the ABF insulating film to substrate makers and is an upstream enabler, not a substrate maker. Which substrate maker supplies a given GPU is reported, not disclosed.

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