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COMPANY RESEARCH / 3189.TW

Kinsus Interconnect Technology

IC package substrates (named by ASE as a supplier)

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Where it fits in an AI server rack

ASE’s 2025 Form 20-F names Kinsus, with Nan Ya PCB and Unimicron, among the limited number of IC substrate suppliers, in a passage on AI-driven HPC demand and the risk of ABF substrate shortages.

What the evidence establishes

Adjacent technology

Partner-disclosed: ASE’s 2025 Form 20-F names Kinsus among its IC substrate suppliers; AI-rack use is an inference.

A relevant component capability used across electronics. Its use in AI racks is an inference, not a disclosed customer relationship.

Component roleIC package substrates (named by ASE as a supplier)
EvidencePartner-disclosed: ASE’s 2025 Form 20-F names Kinsus among its IC substrate suppliers; AI-rack use is an inference.
How we knowPartner-disclosed A named partner, customer or platform owner’s document names the company. The scope is that document’s product or program, not a general supply relationship.
Primary sourceKinsus Interconnect Technology — supporting disclosure
Company or official disclosure; vendor claims are attributed to their source.
Checked. This is the research review date, not the source publication or quote time.

Keep in perspective

No Kinsus source was captured (its website refused connections on Sept 24, 2026), and no AI-accelerator program is documented; the ASE mention does not tie Kinsus to a specific product.

Diversified business exposure. This describes the breadth or role of the business; it is not an investment rating. An AI-server product, design-in or partnership does not by itself establish material AI-rack revenue, market share, or future returns.

Connections to the assembly

These links explain the technology relationship. The model is illustrative and does not represent an actual manufacturer’s bill of materials.

ABF package substrate

A large multilayer organic substrate made with build-up film. It fans the interposer’s dense connections out to the pitch of the board and carries power to the dies.

Scope of the company links: ABF (FCBGA) package substrates. Ibiden (strong GPU demand, substrates for AI servers and switching ICs) and Samsung Electro-Mechanics (FCBGAs for AI accelerators and server CPUs) disclose AI-accelerator substrate supply without naming customers. Unimicron markets FCBGA for AI servers and switches, and Nan Ya PCB is developing large, high-layer substrates for AI and HPC (positioning). Kinsus is named by ASE as an IC substrate supplier, with no AI program documented. Ajinomoto supplies the ABF insulating film to substrate makers and is an upstream enabler, not a substrate maker. Which substrate maker supplies a given GPU is reported, not disclosed.

Related research

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