AI Server Rack Stocks in 3D | stock3d by Fynca

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Illustrative rack · not a bill of materials

HOW IT WORKS5 parts

The engines

GPUs, HBM & packaging

The accelerator package is where the rack computes: GPU or custom-accelerator dies sit beside stacks of high-bandwidth memory on a silicon interposer, mounted on a large organic substrate. Each Blackwell GPU packs 208 billion transistors on two reticle-limited dies joined at 10 TB/s, and a GB300 NVL72 rack carries 20 TB of HBM3E across its 72 GPUs (NVIDIA).

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INSIDE THE SYSTEM5 parts

A superchip-style module: two GPU packages and a host CPU on one board. Each GPU package places two large logic dies and eight HBM stacks on an interposer, mounted on an organic substrate that fans the connections out to the board.

Design scope & sources

A schematic superchip module: two GPU packages and one CPU on a board, each package with two logic dies and eight HBM stacks on an interposer and an ABF substrate. Die size, stack count and height, bump pitch and board layout are illustrative. NVIDIA documents the two reticle-limited dies and the 10 TB/s link between them but publishes no package drawing. The interposer is drawn as one silicon slab; TSMC’s CoWoS-L embeds small silicon bridges instead, and the cited pages do not say which variant a given GPU uses.

Custom accelerators built by or for cloud companies, such as Google’s liquid-cooled Ironwood TPU with 192 GB of HBM per chip, follow the same logic-plus-HBM recipe with different dies. CoWoS-R replaces the silicon interposer with a polymer-and-copper redistribution layer. HBM4, published by JEDEC in April 2025, widens each stack’s interface to 2,048 bits, and some designs put one GPU per module or pair GPUs with x86 hosts on separate boards.

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GPUs, HBM & packaging — The accelerator package is where the rack computes: GPU or custom-accelerator dies sit beside stacks of high-bandwidth memory on a silicon interposer, mounted on a large organic substrate. Each Blackwell GPU packs 208 billion transistors on two reticle-limited dies joined at 10 TB/s, and a GB300 NVL72 rack carries 20 TB of HBM3E across its 72 GPUs (NVIDIA).
CPUs, memory & storage — Each compute tray pairs its GPUs with host CPUs that run the operating system and stage data, CPU memory, E1.S flash drives, a management controller and a high-layer-count, low-loss motherboard. A GB200 NVL72 rack carries 36 Grace CPUs with 2,592 Arm cores and up to 17 TB of LPDDR5X (NVIDIA).
Switches & network chips — An AI rack runs two networks. The scale-up fabric joins all 72 GPUs through NVLink Switch trays at 130 TB/s, and the scale-out network gives each GPU an 800 Gb/s SuperNIC link to top-of-rack and leaf switches that tie racks into a cluster (NVIDIA GB300 NVL72). DPUs, PCIe retimers and PCIe switches handle storage, security and the lanes inside each tray.
Cables, optics & connectors — Links move data between GPUs, trays and racks. Inside an NVL72-class rack the GPUs reach the NVLink switch trays over a copper cable cartridge, with no optics, while scale-out traffic leaves the rack through pluggable optical transceivers and fiber at 800 Gb/s per GPU in GB300 NVL72 (NVIDIA). Fujikura’s AFL says a leading-edge NVL72 rack can be fed with up to 1,152 fibers.
Power shelves & delivery — Power shelves turn facility AC into about 50 V DC, a copper busbar carries it to every tray, and voltage regulators step it down to under 1 V at the chips, while capacitors and batteries ride through outages and load swings. In GB200/GB300-class racks a 33 kW shelf holds six hot-swap 5.5 kW supplies (Vertiv PowerDirect 3000). NVIDIA says a 1 MW rack at 54 V would need up to 200 kg of copper busbar, one reason it plans 800 V DC distribution from 2027.
Liquid cooling — Direct-to-chip liquid cooling pumps coolant through copper cold plates on the GPUs and CPUs, then through rear manifolds and dripless quick disconnects to a coolant distribution unit that passes the heat to facility water. NVIDIA’s GB200 NVL72 design calls for 120 kW of cooling per rack and uses a blind-mate manifold with floating tray connections so the quick disconnects align as trays dock (NVIDIA, Oct 2024).
Fans & airflow — Fans still move air through power shelves, switch trays and any parts not on cold plates, and a rear-door heat exchanger can catch the warm exhaust in a water coil; temperature sensors and fan controllers set the airflow. In the Schneider Electric–AMD Helios reference design, liquid removes 84% of the rack’s heat and air handles the remaining 16% (Motivair, July 2026).
Racks, chassis & rails — The rack is the steel structure that holds and services everything else: a 48U-class OCP/MGX frame, a sheet-metal chassis for every tray, telescopic rails so trays slide out, and casters and feet so the integrated rack can roll in and stand level. Supermicro’s GB300 NVL72 enclosure measures 600 × 1,068 × 2,236 mm (W × D × H), and Rittal rates its MGX rack for dynamic loads up to 1,400 kg.
Rack builders & platforms — The companies that design, manufacture, integrate or sell complete AI servers and racks: branded server makers (OEMs), original design manufacturers (ODMs) and contract manufacturers (EMS) building on platforms such as NVIDIA’s GB300 NVL72. This group is not a physical part; a builder is listed for its own servers and racks, and under a part only when separately documented as making it. Hon Hai expects its AI-rack shipments to more than double in 2026 (Aug 12, 2026).

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