Skip to research
stock3dby Fynca
Explore in 3D

COMPANY RESEARCH / MTSI

MACOM Technology Solutions

Drivers, TIAs and lasers for 800G/1.6T optics

Published by FyncaResearch checked How we research

Where it fits in an AI server rack

MACOM’s FY2025 10-K lists TIAs, modulator drivers, lasers and photodetectors that enable 800G, 1.6T and 3.2T optical transceivers for data centers serving AI, machine learning and high-performance computing; Data Center revenue grew 48.0% to $292.8 million, 30.3% of $967.3 million.

What the evidence establishes

AI-rack evidence

Disclosed: MACOM’s FY2025 10-K describes its data-center optical chipsets and Data Center revenue.

An explicit AI-server or AI-rack product, design-in, supply role, program, reference design or partnership, such as a part named for rack-scale AI systems or a product sold for AI data centers. For a rack builder, it means the company’s own AI servers or racks. This does not establish revenue, market share, volumes or future sourcing.

Component roleDrivers, TIAs and lasers for 800G/1.6T optics
EvidenceDisclosed: MACOM’s FY2025 10-K describes its data-center optical chipsets and Data Center revenue.
How we knowDisclosed The company’s own filing, release, annual report, product page or investor record describes the AI-server or AI-rack role. Where customers are unnamed, the listing says so.
Primary sourceMACOM Technology Solutions — supporting disclosure
Company or official disclosure; vendor claims are attributed to their source.
Checked. This is the research review date, not the source publication or quote time.

Keep in perspective

No direct customer reached 10% of revenue, and AI-specific design wins are not named. Most revenue comes from industrial, defense and telecom markets.

Diversified business exposure. This describes the breadth or role of the business; it is not an investment rating. An AI-server product, design-in or partnership does not by itself establish material AI-rack revenue, market share, or future returns.

Connections to the assembly

These links explain the technology relationship. The model is illustrative and does not represent an actual manufacturer’s bill of materials.

Lasers & photonics

Electro-absorption modulated or continuous-wave lasers, and silicon-photonics chips, that turn the signal into light inside the transceiver.

Scope of the company links: InP lasers (EML, CW, VCSEL) and silicon-photonics chips inside modules and co-packaged engines. Lumentum and Coherent make EMLs and CW/high-power lasers and hold NVIDIA purchase commitments for lasers (Mar 2, 2026); Mitsubishi Electric estimates it led data-center EML chips in FY25 and plans over 3x EML capacity by FY30; Sumitomo Electric makes EMLs and CW lasers for AI data centers; Broadcom runs in-house InP/GaAs laser fabs and sells a pluggable laser source for its CPO switches. TSMC provides the silicon photonics in NVIDIA’s CPO switches, Tower runs silicon-photonics foundry platforms for 400G–1.6T modules, TFC makes external-laser-source modules, Furukawa sells CW-DFB chips for silicon photonics, Marvell includes silicon photonics in its interconnect portfolio and MACOM sells lasers and photodetectors. AXT supplies InP substrates upstream. AOI makes laser chips only for its own modules and is mapped under transceivers. TrendForce (reported, context only) puts combined EML and CW-DFB capacity near 50.7 million units a month in 2026.

Optical DSPs & drivers

PAM4 digital signal processors, laser drivers and amplifiers that encode, equalize and retime the signal at each end of an optical link.

Scope of the company links: PAM4 DSPs retime and equalize each lane; drivers and TIAs amplify the electrical signal on each side of the laser and photodiode. Marvell (PAM DSPs, laser drivers, TIAs and LPO chipsets for AI data centers, FY2026 10-K), Credo (Bluebird, a 3 nm 200G-per-lane DSP for 1.6T modules, plus 100G-per-lane families, FY2026 10-K) and MACOM (TIAs and modulator drivers for 800G–3.2T modules, FY2025 10-K) are mapped, and Semtech’s TIA and modulator driver were demonstrated in NVIDIA’s 1.6T DR8 OSFP transceiver at OFC 2026. Broadcom’s optical DSP line could not be read from a primary source in our review, so Broadcom is mapped under lasers only. Linear-drive (LPO/LRO) modules drop some DSP functions, and NVIDIA says its co-packaged switches need no DSP retimers.

Related research

Companies with overlapping sector exposure. Their products and evidence may differ; this is not a list of equivalent investments.

Suggest a correction · Research and market-data disclosures