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GlobalFoundries

Quantum foundry business for QPUs and cryo-CMOS

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Where it fits in a quantum computer

Launched Quantum Technology Solutions on May 21, 2026 to manufacture QPUs, the cryogenic read-out and control ICs that run them and the advanced packaging and superconducting interconnects that join them, and is developing QPU manufacturing platforms for superconducting, trapped-ion, photonic, topological and spin qubits. In the release PsiQuantum calls its partnership with GF critical, Quantinuum calls GF an important partner in scaling ion traps, and Diraq, Equal1 and Quantum Motion describe cryogenic-CMOS and spin-qubit work with GF (Diraq on its FDX platform). The U.S. Department of Commerce finalized a $375M five-year R&D award for the business on Sept 8, 2026, and under a separate agreement is to receive a strategic equity investment equal to about 1% of GF.

What the evidence establishes

Quantum-computing evidence

Disclosed: GF’s May 2026 release launches Quantum Technology Solutions with quotes from PsiQuantum, Quantinuum, Diraq, Equal1 and Quantum Motion, and its Sept 2026 release finalizes the $375M award.

An explicit quantum-computing product, design-in, supply role, program or partnership, such as a part sold for quantum computers or a named quantum-computer customer. For a maker, it means the company’s own quantum computers or processors. This does not establish revenue, market share, volumes or future sourcing.

Component roleQuantum foundry business for QPUs and cryo-CMOS
EvidenceDisclosed: GF’s May 2026 release launches Quantum Technology Solutions with quotes from PsiQuantum, Quantinuum, Diraq, Equal1 and Quantum Motion, and its Sept 2026 release finalizes the $375M award.
How we knowDisclosed The company’s own filing, release, annual report, product page or investor record describes the quantum-computing role. Where customers are unnamed, the listing says so.
Primary sourceGlobalFoundries — supporting disclosure
Company or official disclosure; vendor claims are attributed to their source.
Checked. This is the research review date, not the source publication or quote time.

Keep in perspective

The partner work named today is photonic, ion-trap and spin-qubit chips and cryogenic CMOS; superconducting QPU manufacturing is still in development, and GF reports no quantum revenue. The $375M is tied to milestones over five years, and GF’s FY2025 Form 20-F predates the business.

Platform business exposure. This describes the breadth or role of the business; it is not an investment rating. A quantum-computing product, design-in or partnership does not by itself establish material quantum revenue, market share, or future returns.

Connections to the assembly

These links explain the technology relationship. The model is illustrative and does not represent an actual manufacturer’s bill of materials.

Qubit chip

A silicon die patterned with about a hundred superconducting transmon qubits, the tunable couplers between them and a readout resonator for each. The quantum state lives in these circuits.

Scope of the company links: The qubit die. Makers that design and fabricate their own superconducting chips come first: IBM (Nighthawk links 120 qubits with 218 tunable couplers; wafers made at a 300 mm facility in Albany, where its company Anderon runs a pure-play quantum wafer foundry), Google (105-qubit Willow from its Santa Barbara fab), Rigetti (Fab-1, chiplet-based Cepheus systems, Novera QPUs sold to others), IQM (chips from its own clean room), D-Wave (superconducting annealing QPUs whose wafers SkyWater makes), AWS (the Ocelot cat-qubit prototype) and Fujitsu (a 256-qubit chip co-developed with RIKEN). IonQ is mapped only because it has owned SkyWater, D-Wave’s wafer foundry, since July 31, 2026. GlobalFoundries (a quantum foundry business launched in May 2026 with photonic, ion-trap and spin-qubit partners, developing superconducting processes) and STMicroelectronics (Quobly’s silicon spin-qubit devices in Crolles) are foundries, and Intel’s 12-qubit Tunnel Falls is a silicon spin chip. Trapped-ion, neutral-atom and photonic machines use different hardware and sit under makers. QuantWare, Oxford Quantum Circuits, Quobly and Qolab are private; research fabs such as imec and MIT Lincoln Laboratory are not companies and are not mapped.

Flip-chip bonds

Indium bumps that join the qubit die face down onto a second die carrying readout and control wiring, so signals reach the middle of the chip from above instead of only from its edges.

Scope of the company links: Flip-chip bonds and 3D integration. Rigetti’s 10-K describes in-house superconducting multi-chip bonding for chip-level 3D integration and superconducting through-silicon vias, used in its chiplet-based systems, and AWS’s Ocelot stacks two bonded silicon chips of about 1 cm² each. GlobalFoundries says it is developing a cryogenic and superconducting heterogeneous interconnect platform (positioning), and Oxford Instruments markets deep silicon etch for through-silicon vias in quantum circuits; its PECVD tool appears in QuTech’s 2026 indium-bump qubit recipe. The indium in that recipe came from Indium Corporation and the gold evaporator from AJA International, both private, and QuantWare (private) sells VIO chiplet packaging. No bonder maker (Besi, Kulicke & Soffa) documents a quantum role, so none is mapped.

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